APPLICATIONS
Different Applications, Different Testing Needs.
One Solution: AionSemicon's µ-Bump Contact Technology
HBM (High Bandwidth Memory)
Our fine-pitch contactor technology enables reliable electrical contact with HBM micro-bumps, supporting high-density testing of advanced HBM devices, including HBM4, HBM4E, and custom HBM.
ASIC / SoC (GPU, NPU, CPU)
Our high-density contactor technology provides reliable electrical contact with fine-pitch interconnects of ASICs, GPUs, and NPUs, supporting advanced semiconductor testing.
CPO (Co-Packaged Optics)
Our fine-pitch contactor technology enables high-density electrical testing of optical engines, including PIC and EIC, supporting next-generation CPO applications of μ-Bump sizes down to 30 – 40 μm.
Interposer (Si, Glass, RDL)
Our fine-pitch contactors enable reliable electrical contact with high-density interposer pads, supporting advanced testing Interposer of sizes up to 100x100 mm²
Cu Pillar / Hybrid Bonding
Our fine-pitch contactor technology enables direct electrical contact with Cu pillars and Cu pads, supporting pre-bond electrical testing for 3D packaging and hybrid bonding of pitches less than 10μm
