TECHNOLOGY
Smaller Bumps, Higher I/O Density
As semiconductor packaging advances, bump sizes and pitches
continue to shrink, enabling more I/O connections in the same area
Fine Pitch Socket
As package pin pitch shrinks, conventional methods hit their limits
AionSemicon breaks new ground at pitches less than 0.15mm
- 0.8mm
- 0.5mm
- 0.3mm
- 0.15mm
- 0.05mm
Wider pitchAionSemicon`s Area
Pogo pinPitch > 0.5mm
Rubber pinPitch 0.27–0.5mm
Aion Canta pinPitch < 0.15mm
Canta Pin
Horizontal Cantilever Contact Design
An innovative horizontal cantilever structure featuring independent cantilevers for precise micro-bump contact
See how Canta Pin contacts µ-Bumps
Canta Pin Structure
