PRODUCTS
Bump Socket
A horizontal cantilever structure contacts the underside of the bump horizontally, making stable contact without damaging the bump
Applications
- Fine-pitch Memory (HBM etc.,)
- System Logic (GPU, CPU, ASIC, SoC)
- System Level Test
| Category | Detail | Spec. |
|---|---|---|
| Mechanical | Pitch (μm) | 35 - 55 |
| Stroke(OD) (μm) | 15 - 25 | |
| Thickness (μm) | 40 - 50 | |
| Contact Force (gf/pin) | 0.3 ± 0.1 | |
| PPA(Pin Position Accuracy) (μm) | ±2.0 | |
| Electrical | Contact Resistance (mΩ) | <200 |
| Current (A) | 0.2 |
Product Portfolio
Contactor (for SLT)
Standalone Contactor
Can be mounted directly onto an interposer and PCB, or used for SLT applications
Die socket
Integrated Contactor Assembly
Pre-assembled with an interposer and PCB
Die carrier
Die Carrier for ATE Applications
Enables precise die positioning and alignment during automated semiconductor testing