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TECHNOLOGY
As bump sizes shrink and I/O density increases, fine-pitch contact technology becomes essential. AionSemicon's horizontal cantilever structure enables precise, reliable contact at pitches for 0.15mm or less.
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PRODUCTS
AionSemicon offers micro-bump and pad contactor solutions in various configurations to meet diverse testing requirements. Our products are tailored to customer-specific needs and testing environments.
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APPLICATIONS
AionSemicon's fine-pitch micro-bump contactor technology supports advanced applications from HBM and ASIC/SoC to CPO, Interposers, and hybrid bonding. Our precision engineering enables reliable contact at increasingly finer pitches.
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Technical Inquiry
Let`s talk about
your fine-pitch test challenges.
Share your pitch, package type, and test requirements. Our engineers will review your inquiry and respond with technical guidance.
Inquiry →What to include
- 01Package type & pitch
- 02Test conditions & requirements
- 03Quantity & schedule